AMD Innovative Packaging: Cooler than the Competition




As the industry races to develop chips on smaller geometries, modern applications are demanding faster clock rates and ever-higher performance. Thermal density is increasing, driving the need for more efficient solutions.

Enter AMD lidless packages with stiffener ring, which:

• Are purpose-built for high-end adaptive SoCs, providing better thermal performance
  for larger die and applications that require outstanding performance

• Reduce thermal resistance by up to 11X¹ while adding structural rigidity to
  the package

• Pack more innovation into a smaller footprint when combined with AMD patented
  heat sink etch patterns and phase-change thermal interface materials


AMD offers you a cool solution to a hot problem.


Read White Paper
https://docs.amd.com/v/u/en-US/wp563-therm-pack