Laird Performance Materials

Coolzorb 5G - Hybrid thermal/EMI absorber for high frequency
Kzorb - Dielectric / Absorber System
Eccosorb 5G HiF 1 - 5G high-frequency, dielectrically-loaded elastomer absorber
FlexK-LoK - Low-Loss, low dielectric constant silicone
SNN65-HXP Form-in-Place Gasket - Rapid-cure, Ag-coated nickel-filler elastomer form-in-place gasket material



5G Markets

∙ Telecom infrastructure ∙ Data infrastructure ∙ Mobile infrastructure ∙ Optical transceivers ∙ Consumer electronics ∙ IoT ∙ Servers
∙ Absorber/signal integrity issues ∙ Outdoor applications ∙ Flexible radome ∙ Antenna mounting ∙ Thin dielectric spacing
∙ 5G base stations ∙ PC cards.


5G Product abstracts (5)

Coolzorb 5G
Laird Coolzorb 5G is a hybrid absorber/thermal management material used for EMI mitigation at high frequencies. Serving as a thermal interface material transferring heat away from sensitive components, Coolzorb 5G simultaneously suppresses unwanted energy coupling, resonances or surface currents causing board-level EMI issues. Multiple issue are solved using a single design.




Kzorb
Laird Kzorb is a dielectric/absorber system consisting of a co-rolled dielectric layer with silicone rubber. Kzorb provides attenuation whiling maintaining signal integrity.




Eccosorb 5G HiF 1
Laird Eccosorb 5G HiF 1 is a dielectrically-loaded high frequency elastomer absorber with properties ideal for the higher frequencies of the mmWave range. Highly flexible and suitable for harsh environments, it is based on silicone resin along with an oxidation resistant filler. Eccosorb reduces specular reflections and surface currents as well suppresses cavity resonances, especially above 40Ghz.



FlexK-LoK
Laird FlexK-LoK is a low loss, low dielectric constant silicone. The low-weight rubber sheet for RF and microwave insulation weighs only half that of polystyrene and one quarter that of polytetrafluoroethylene. Waterproof with excellent thermal properties, FlexK-LoK tolerates temperature swings and does not flake or shed. Complex shapes can be die cut.




SNN65-HXP Form-in-Place Gasket Material
Laird SNN65-HXP Form-in-Place Gaskets consist of a rapid-cure, Ag-coated, nickel-filled silicone elastomer form-in-place gasket material. Laird form-in-place gaskets are extremely fast-curing and feature reliable shielding effectiveness and strength. They feature an automated system for dispensing conductive elastomer EMI shielding and grounding gaskets onto metal or plastic substrates.



Features

Coolzorb 5G
• Excellent thermal conductivity
• Excellent EMI suppression in the microwave frequency range
• Inherent surface tack
• Passes UL 94 V-O requirements

Kzorb
• Provides attenuation
• Maintains signal integrity
• Can be placed around chip, on PCB or onto chip
• Attenuates without effect to trace impedances
• Addresses absorber/signal integrity concerns

Eccosorb 5G HiF 1
• Ideal for 5G mmWave frequencies
• Silicone based ∙ RoHS/REACH compliant
• High performance at high frequencies > 40Ghz
• Suitable for outdoor installations 40Ghz.

FlexK-LoK
• Low dielectric constant
• Lightweight, flexible
• Excellent thermal insulation
• Highly stable
• Performs well in temperature extremes

SNN65-HXP Form-in-Place Gasket Material
• Extremely rapid-cure
• Reliable shielding
• High strength



Applications

Coolzorb 5G
• Telecom infrastructure
• Optical transceivers
• Consumer electronics
• Servers

Kzorb
• Consumer electronics
• Data infrastructure
• Mobile infrastructure
• Absorber/signal integrity concerns

Eccosorb 5G HiF 1
• Telecom infrastructure
• Mobile telecom
• Consumer electronics
• IoT

FlexK-LoK
• Outdoor installations
• Flexible radome
• Antenna mounting spacer in small electronics
• Electrical separation of components maintaining spacing
• Microwave absorber separation for PCB absorber applications
• Thin dielectric spacer

SNN65-HXP Form-in-Place Gasket Material
• 5G base stations
• PC cards
• Cast enclosures
• Packaged electronic assemblies



Benefits

• High-frequency EMI mitigation
• Thorough heat transfer
• Multi-functional solution featuring EMI protection/thermal transfer in a single process design
• Reliable shielding effectiveness
• Attenuation
• High temperature operation
• Suppression of cavity resonances



Downloads:

• Laird Coolzorb 5G
• Laird Kzorb
• Laird Eccosorb 5G HiF 1
• Laird FlexK-LoK
• Laird SNN65-HXP Form-in-Place Gasket







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